| obraz | KĽÚČ Časť # / Výrobca | Popis / PDF | Množstvo / RFQ |
|---|---|---|---|
 |
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
284345ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Nylon, 4.06x10.16x5.08mm |
137815ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.040. Heat Sinks Semiconductor Mounting Pad, Circular, Nylon, 1.02x5.84mm |
826891ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.080. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 4 Leads, 6.35mm OD, 2.03mm Thickness |
826891ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.025. |
384703ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad |
199681ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT PAD. |
705289ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.125. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular, Nylon, 3.18x7.75mm |
195323ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.080. Thermal Interface Products Semiconductor Mounting Pad for TO-18, DAP, 4 Leads, 6.35mm OD, 2.03mm Thickness |
195323ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.038. |
604533ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18. |
826891ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
672331ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT IC 14DIP 0.050. Heat Sinks Semiconductor Mounting Pad for ICs, 14 Leads, 1.27mm Thickness |
194754ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT PAD. Heat Sinks Semiconductor Mounting Pad, Nylon |
265420ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.9x9.53mm |
382655ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.060. |
734076ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT CRYST CAN REL 0.050. Heat Sinks Semiconductor Mounting Pad, Rectangular, Dialyl Phthalate (DAP), Crystal Can Relays, 20.32x10.16x1.28mm |
164533ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT TO18. Heat Sinks |
237424ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.100. Thermal Interface Products Semiconductor Mounting Pad for TO-18, DAP, 4 Leads, 5.08mm OD, 2.54mm Thickness |
227989ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.038. |
604533ks skladom |
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