| obraz | KĽÚČ Časť # / Výrobca | Popis / PDF | Množstvo / RFQ |
|---|---|---|---|
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Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
21758ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Extruded Heatsink, Radial Fin, Square, 0.79x0.155 Inch |
11128ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 8.38x13.21x19.05mm |
81884ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks High-Rise Style Board Level Stamped Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, Black Anodized, 10.16x44.45x44.7mm |
44944ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. |
3163ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Channel Style Heatsink for TO-220, Folded Back Fins, Vertical Mounting, 6.8 n Thermal Resistance, No Solderable tabs, 2.90mm Hole |
141875ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Board Level Stamped Heatsink for TO-202, Vertical Mounting, 9.52x19.05x19.05mm |
71827ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. |
6911ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8x12.7x12.7mm |
36131ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks High Power Extruded Style Heatsink for MULTIWATT, Vertical Mounting, 5.8 n Thermal Resistance, Black Anodized, 2.89mm Hole, 38.1mm, Solderable Pins |
38264ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Heatsink for TO-5, Vertical Mounting, 12.7x12.7x9.52mm |
54891ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. |
2070ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 30x30x7mm, IC Pkg Size = 30 x 30, Epoxy |
103241ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Vertical Mounting, 22.23x22.23x13.49mm |
39987ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6x25.4x25.4mm |
23471ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Rail Mounting Heatsink Clip, Stainless Steel |
473765ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Thermal Link with BeO Insulator for TO-5, Vertical Mounting, Black Anodized, 15 n Thermal Resistance |
9207ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
BOARD LEVEL HEAT SINK. Heat Sinks Board Level Extruded Heatsink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height |
54530ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks Stamped Heatsink for Axial Lead Devices, Vertical Mounting, Copper, 15 n Thermal Resistance, Tin Plated |
46895ks skladom |
|
Aavid, Thermal Division of Boyd Corporation |
HEAT SINK. Heat Sinks BGA Heatsink, Bi-Directional, Black Anodized, 25x25x10mm, IC Pkg Size = 25 x 25, Epoxy |
73229ks skladom |
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